Applied Physics Letters, 4 July 2022, Volume 121, Issue 1

Posted on 2022/07/04

by sg_portfolio

Journal: Applied Physics Letters
Publisher: AIP
Article Title: Upconversion semiconductor interfaces by wafer bonding for photovoltaic applications
Authors: Naoki Sano, Kosuke Nishigaya, Katsuaki Tanabe
Paper link: https://pubs.aip.org/aip/apl/article-abstract/121/1/011601/2833811/Upconversion-semiconductor-interfaces-by-wafer?redirectedFrom=fulltext
Journal issue link: https://pubs.aip.org/aip/apl/issue/121/1