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ACS Applied Electronic Materials, 11 March 2025, Volume 7, Issue 5

ACS Applied Electronic Materials, 11 March 2025, Volume 7, Issue 5

Posted on 2025/03/11

by sg_portfolio

Conductive Pathway Formation
Copper–Nickel Inks
Cu–Ni Inks
Electrical Conductivity
Electronic Components
In Situ Rheoimpedance
Metal-Based Conductive Inks
Oxidation Resistance
Real-Time Monitoring
TG-DTA
Thermal Sintering
Thermogravimetry-Differential Thermal Analysis

ACS
ACS Applied Electronic Materials

Journal: ACS Applied Electronic Materials
Publisher: ACS
Article Title: In Situ Rheoimpedance and Thermogravimetry–Differential Thermal Analysis of Copper-Based Conductive Inks for High-Oxidation-Resistant Performance
Authors: Reina Ishikawa, Yuki Kawata and Hideya Kawasaki
Paper link: https://pubs.acs.org/doi/10.1021/acsaelm.4c01894
Journal issue link: https://pubs.acs.org/toc/aaembp/7/5